本公司代理的三磨所生产的划片刀刀刃超薄且有超高强度，刀刃厚度最薄规格10-15微米，最厚超过100微米，满足各种街区宽度、晶粒大小的尺寸要求，可以实现对超薄硅晶圆、小晶粒硅晶圆的高品质切割，避免背面崩角或裂片的现象，有效解决背崩难题。

The cutting blades produced by Sanmo are ultra-thin and have ultra-high strength. The thinnest blade thickness is 10-15 microns, and the thickest is over 100 microns, meeting the size requirements of various block widths and grain sizes. It can achieve high-quality cutting of ultra-thin silicon wafers and small grain silicon wafers, avoiding the phenomenon of back corner breakage or fragmentation, and effectively solving the problem of back breakage.